Asus has recently released two new Zenfones. The YouTube channel PBKreviews has decided to give us an inside look at the company’s newest Flip models. Even though the company has retained most of the hardware specifications, there are still some differences.
It is interesting to see how Asus managed to fir in the flip camera module in the body. The video starts by removing the back cover and the protective cover of the phone. Similar to last year’s offering, the microphone bay is placed on the bottom area of the phone, along with the charging connector. The 5,000mAh is attached to the body of the phone using several connectors.
Removing a few screws here and there gives us access to the motherboard. The camera module is also easy to remove. Asus has included two water damage indicators on the side of the phone. The top cover of the phone is made from glass and stays in place using an adhesive that enables easy replacement. Overall, the phone is quite difficult to disassemble. The reviewer gives the Asus Zenfone 8 Flip a score of 4 out of 10, considering how time-consuming it is.
The Zenfone 8 Flip comes with the Snapdragon 888 processor that supports 5G connectivity. It is powered by 8GB of RAM and offers up to 256GB of internal storage. The phone’s main selling point is the Motorized Flip-up triple camera setup that can also be used as the front camera. It comes with a 5,000mAh battery that supports 30W fast charging.
