A few days ago, we gave you a glimpse of what to expect in the upcoming Galaxy Unpacked event that will take place in August this year.
The Galaxy Z Flip 3 was one of the phones leaked by the noted tipster Evan Blass a few days ago.
Now, the first Samsung Galaxy Z Flip 3 benchmark has been leaked online. The benchmark reveals the key specifications of the phone.
Having said that, this is the first time the Samsung Galaxy Z Flip 3 has been spotted on Geekbench. It has the model number SM-F711U, which will be going to the North American market. The Geekbench listing tells us the processor used the RAM available on the base variant of the phone.
The motherboard used here is Lahaina, which is the codename for the Qualcomm Snapdragon 888 chipset, which will be coming to all US variants of the phone.
Moreover, the device listing confirms the fact that the Samsung Galaxy Z Flip 3 will be backed by at least 8GB of RAM.
This will appeal to customers who were looking forward to a flagship-level foldable smartphone from the Korean manufacturer.
The Unpacked event will start on August 11, with Samsung unveiling the Galaxy Z Flip 3 alongside the Galaxy Z Fold 3.
Another foldable Samsung device has been spotted on Geekbench that will come with 12GB of RAM. We think it’s the higher-end version of the Galaxy Z Flip 3.
We cannot wait for August 11!
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